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| NUD4001 High Current LED Driver This device is designed to replace discrete solutions for driving LEDs in low voltage AC-DC applications 5.0 V, 12 V or 24 V. An external resistor allows the circuit designer to set the drive current for different LED arrays. This discrete integration technology eliminates individual components by combining them into a single package, which results in a significant reduction of both system cost and board space. The device is a small surface mount package (SO-8). Features http://onsemi.com PIN CONFIGURATION AND SCHEMATIC Vin Boost Rext GND 1 2 3 4 Current Set Point 8 7 6 5 Iout Iout Iout Iout * * * * * * * * Supplies Constant LED Current for Varying Input Voltages External Resistor Allows Designer to Set Current - up to 500 mA Offered in Surface Mount Package Technology (SO-8) Pb-Free Package is Available Maintains a Constant Light Output During Battery Drain One Device can be used for Many Different LED Products Reduces Board Space and Component Count Simplifies Circuit and System Designs Benefits Typical Applications * Portables: For Battery Back-up Applications, also Simple Ni-CAD * * Battery Charging Industrial: Low Voltage Lighting Applications and Small Appliances Automotive: Tail Lights, Directional Lights, Back-up Light, Dome Light MARKING DIAGRAM 8 8 1 SO-8 CASE 751 STYLE 25 1 4001 AYWW G PIN FUNCTION DESCRIPTION Pin 1 2 3 4 5, 6, 7, 8 Symbol Vin Boost Rext GND Iout Description Positive input voltage to the device This pin may be used to drive an external transistor as described in the App Note AND8198/D. An external resistor between Rext and Vin pins sets different current levels for different application needs Ground The LEDs are connected from these pins to ground 4001 A Y WW G = Specific Device Code = Assembly Location = Year = Work Week = Pb-Free Device ORDERING INFORMATION Device NUD4001DR2 NUD4001DR2G Package SO-8 SO-8 (Pb-Free) Shipping 2500 / Tape & Reel 2500 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. (c) Semiconductor Components Industries, LLC, 2006 June, 2006 - Rev. 6 1 Publication Order Number: NUD4001/D NUD4001 MAXIMUM RATINGS (TA = 25C unless otherwise noted) Rating Continuous Input Voltage Non-repetitive Peak Input Voltage (t v 1.0 ms) Output Current (For Vdrop 2.2 V) (Note 1) Output Voltage Human Body Model (HBM) Symbol Vin Vp Iout Vout ESD Value 30 60 500 28 1000 Unit V V mA V V Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Vdrop = Vin - 0.7 V - VLEDs. THERMAL CHARACTERISTICS Characteristic Operating Ambient Temperature Maximum Junction Temperature Storage Temperature Total Power Dissipation (Note 2) Derating above 25C (Figure 3) Thermal Resistance, Junction-to-Ambient (Note 2) Thermal Resistance, Junction-to-Lead (Note 2) 2. Mounted on FR-4 board, 2 in sq pad, 2 oz coverage. Symbol TA TJ TSTG PD RqJA RqJL Value -40 to +125 150 -55 to +150 1.13 9.0 110 77 Unit C C C W mW/C C/W C/W ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristic Output Current1 (Vin = 12 V, Rext = 2.0 W, VLEDs = 10 V) Output Current2 (Vin = 30 V, Rext = 7.0 W, VLEDs = 24 V) Bias Current (Vin = 12 V, Rext = Open, VLEDs = 10 V) Voltage Overhead (Note 3) 3. Vover = Vin - VLEDs. Symbol Iout1 Iout2 IBias Vover Min 305 95 - 1.4 Typ 325 105 5.0 - Max 345 115 8.0 Unit mA mA mA V - http://onsemi.com 2 NUD4001 TYPICAL PERFORMANCE CURVES (TA = 25C unless otherwise noted) 1000 0.9 0.8 0.7 100 Vsense (V) 1 10 IOUT (mA) 100 1000 Rext, W 0.6 0.5 0.4 0.3 0.2 0.1 1 0.0 -40 -25 -10 5 20 35 50 65 80 95 110 125 140 155 TJ, JUNCTION TEMPERATURE (C) 10 Figure 1. Output Current (IOUT) vs. External Resistor (Rext) 1.200 PD, POWER DISSIPATION (W) 1.000 PD_control (W) 0.800 0.600 0.400 0.200 0.000 25 0.500 0.450 0.400 0.350 0.300 0.250 0.200 0.150 0.100 0.050 35 45 55 65 75 85 95 105 115 125 0.000 0 Figure 2. Vsense vs. Junction Temperature 5 10 15 Vin (V) 20 25 30 TA, AMBIENT TEMPERATURE (C) Figure 3. Total Power Dissipation (PD) vs. Ambient Temperature (TA) 1.2 OUTPUT CURRENT, NORMALIZED 1.0 0.8 0.6 0.4 0.2 Figure 4. Internal Circuit Power Dissipation vs. Input Voltage 0.0 -40 -25 -10 5 20 35 50 65 80 95 110 125 140 155 TJ, JUNCTION TEMPERATURE (C) Figure 5. Current Regulation vs. Junction Temperature http://onsemi.com 3 NUD4001 APPLICATION INFORMATION Design Guide NUD4001 Vin 1 2 3 4 Current Set Point 8 7 6 5 Iout Iout Iout Iout 1. Define LED's current: a. ILED = 350 mA 2. Calculate Resistor Value for Rext: a. Rext = Vsense (see Figure 2) / ILED b. Rext = 0.7 (TJ = 25 C)/ 0.350 = 2.0 W 3. Define Vin: a. Per example in Figure 6, Vin = 12 V 4. Define VLED @ ILED per LED supplier's data sheet: a. Per example in Figure 6, VLED = 3.5 V + 3.5 V + 3.5 V = 10.5 V 5. Calculate Vdrop across the NUD4001 device: a. Vdrop = Vin - Vsense - VLED b. Vdrop = 12 V - 0.7 V (TJ = 25 C) - 10.5 V c. Vdrop = 0.8 V 6. Calculate Power Dissipation on the NUD4001 device's driver: a. PD_driver = Vdrop * Iout b. PD_driver = 0.8 V x 0.350 A c. PD_driver = 0.280 Watts 7. Establish Power Dissipation on the NUD4001 device's control circuit per Figure 4: a. PD_control = Figure 4, for 12 V input voltage b. PD_control = 0.055 W 8. Calculate Total Power Dissipation on the device: a. PD_total = PD_driver + PD_control b. PD_total = 0.280 W + 0.055 W = 0.335 W 9. If PD_total > 1.13 W (or derated value per Figure 3), then select the most appropriate recourse and repeat steps 1 through 8: a. Reduce Vin b. Reconfigure LED array to reduce Vdrop c. Reduce Iout by increasing Rext d. Use external resistors or parallel device's configuration (see application note AND8156) 10. Calculate the junction temperaure using the thermal information on Page 7 and refer to Figure 5 to check the output current drop due to the calculated junction temperature. If desired, compensate it by adjusting the value of Rext. 12 V Boost Rext GND Figure 6. 12 V Application (Series LED's Array) http://onsemi.com 4 NUD4001 TYPICAL APPLICATION CIRCUITS D1 1N4004 R1 2.7 W, 1/4 W 1 2 4 Q1 8 7 5 R3 2.7 W, 1/4 W 1 2 4 Q2 8 3 NUD4001 6 7 NUD4001 6 3 5 R4 32 W, 5.0 W Vbat + 13.5 Vdc - R2 32 W, 5.0 W R3 6.7 W, 4.0 W LED1 Luxeon Emitter 550 mA 0 Figure 7. Stop light automotive circuit using the NUD4001 device to drive one high current LED (550 mA). D1 1N4004 R1 7.0 W, 1/4 W 1 2 4 Q1 8 7 5 R2 7.0 W, 1/4 W 1 2 4 Q2 8 3 NUD4001 6 7 3 NUD4001 6 5 Vbat + 13.5 Vdc - R3 27 W, 2.0 W LED1 Luxeon Emitter 220 mA 0 Figure 8. Dome light automotive circuit using the NUD4001 device to drive one LED (220 mA). http://onsemi.com 5 NUD4001 1 Rext1 2.0 W, 1/4 W Rext2 110 k, 1/4 W 2 4 Q1 8 7 3 NUD4001 6 5 LED1 LXHL-MW1D Vbat + 12 Vdc - Q2 2N2222 LED2 LXHL-MW1D PWM LED3 LXHL-MW1D 0 Figure 9. NUD4001 Device Configuration for PWM D1 MURA105T3 D2 MURA105T3 R2 2.0 W, 1/4 W 1 2 4 Q2 8 7 3 NUD4001 6 5 LED1 Luxeon Emitter 350 mA LED2 Luxeon Emitter 350 mA 12 Vac from: 60 Hz Transformer or Electronic Transformer C1 220 mF D3 MURA105T3 D4 MURA105T3 LED3 Luxeon Emitter 350 mA 0 Figure 10. 12 Vac landscape lighting application circuit using the NUD4001 device to drive three 350 mA LEDs. http://onsemi.com 6 NUD4001 THERMAL INFORMATION NUD4001 Power Dissipation The power dissipation of the SO-8 is a function of the pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RqJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet for the SO-8 package, PD can be calculated as follows: T * TA PD + Jmax RqJA reduce the thermal resistance. Figure 11 shows how the thermal resistance changes for different copper areas. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad(R). Using a board material such as Thermal Clad or an aluminum core board, the power dissipation can be even doubled using the same footprint. 180 160 140 qJA (C/W) 120 100 80 60 The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 1.13 W. PD + 150C * 25C + 1.13 W 110C The 110C/W for the SO-8 package assumes the use of a FR-4 copper board with an area of 2 square inches with 2 oz coverage to achieve a power dissipation of 1.13 W. There are other alternatives to achieving higher dissipation from the SOIC package. One of them is to increase the copper area to 250 0 1 2 3 4 5 6 7 8 9 10 BOARD AREA (in2) Figure 11. qJA versus Board Area 1S -36.9 sq. mm -0.057 in sq. 200 R(q) (C/W) 150 100 50 0 0.000001 1S -75.8 sq. mm -0.117 in sq. 1S -150.0 sq. mm -0.233 in sq. 1S -321.5 sq. mm -0.498 in sq. 1S -681.0 sq. mm -1.056 in sq. 1S -1255.0 sq. mm -1.945 in sq. 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 TIME (sec) Figure 12. Transient Thermal Response http://onsemi.com 7 NUD4001 PACKAGE DIMENSIONS SO-8 CASE 751-07 ISSUE AF -X- A 8 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244 B 1 S 4 0.25 (0.010) M Y M -Y- G K C -Z- H D 0.25 (0.010) M SEATING PLANE N X 45 _ 0.10 (0.004) M J ZY S X S DIM A B C D G H J K M N S SOLDERING FOOTPRINT* 1.52 0.060 STYLE 25: PIN 1. VIN 2. N/C 3. REXT 4. GND 5. IOUT 6. IOUT 7. IOUT 8. IOUT 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Thermal Clad is a registered trademark of the Bergquist Company. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 8 NUD4001/D |
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